The macromodule allows the implementation of complex circuits, that is, up to 200 integrated circuits (ICs) in a single aluminum package. The end product is a large hermetically-sealed, ready-to-plug-in module. A strong commitment was fostered in conjunction with this concept to solve the problem of interconnection associated with the partitioning of 32-bit digital circuit chips. Some of the major technological processes that had to be developed to accommodate the macromodule included: a glass/aluminum sealing process for feedthroughs, a laser-based sealing process for lids, the fabrication of very large modules, that is, 6' x 6' thick-film substrate, with 10 conductive layers and fine lines (5 mils) and a bonding process to integrate large substrates into a large-sized Kovar or Aluminum package. In addition, to manufacture macromodules necessitates the intensive use of CAD/CAM capabilities, specifically for: schematic simulation, already integrating bilbo specific chips for testability, automatic test and fault finding, accomplished with high-performances instrumentation, mechanical simulation and thermal simulation. The results of our studies are then discussed and some pertinent data and information is offered. We conclude this paper by presenting the different tyes of macromodules now in production for military and space equipment.
Macromodules for military and space equipment design, technology and trend
Entwurf, Technologie und Trend der Makromodule für das Militär und die Raumfahrt
1989
11 Seiten, 7 Bilder, 1 Tabelle
Aufsatz (Konferenz)
Englisch
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