Conductor surfaces on printed-circuit boards (PCBs) plated with tin-lead alloy and later fused (reflown or melted) can display a variety of topographical features. Surfaces should be bright and shiny as it is difficult to disposition PCBs with unusual grainy features during subjective quality inspection. This report provides workmanship standards of undesirable surface finishes that have been compared against destructive solderability and metallographic tests. Tin-lead platings with a large grain size or composition markedly different from the eutectic are unsuitable for fusing. Attempts to improve a poor surface finish by multiple fusing operations are totally unacceptable.


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    Titel :

    Examination of fused tin-lead plated printed-circuit boards supporting various surface features


    Weitere Titelangaben:

    Pruefung von geschmolzenen Zinn-Blei-Plattierungen auf Leiterplatten bei verschiedenen Oberflaecheneigenschaften


    Beteiligte:
    Dunn, B.D. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1989


    Format / Umfang :

    30 Seiten, 42 Bilder, 2 Tabellen, 5 Quellen


    Medientyp :

    Report


    Format :

    Print


    Sprache :

    Englisch





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