Avionics standard modules with redundancy offer substantial economic benefits compared to special-purpose processor units for the Orbital Transfer Vehicle and Advanced Launch Vehicle programs. A distributed, federated processing vehicle architecture provides efficient, low-risk, flexible design. Fault confinement area redundancy minimizes complexity, prevents fault propagation, allows appropriate redundancy, and enhances modularity. A fiber optic, serial vehicle bus provides high throughout with modest hardware. A unique bistage, split tapered, star optical coupler uses a token pass/token demand protocol. The system bus is an asynchronous, high-speed, parallel bus that uses a simple, round-robin token pass protocol. Off-the-shelf MIL temperature processor chips will be combined with ASICs using macrocell libraries and gate array silicon. A new packaging approach, VIP, provides testability, ease of assembly and rework, reliable connections, and electrical/thermal isolation of very high speed/density integrated circuits.
Avionics standard module development
Entwicklung von Standardmodulen fuer die Avionik
1987
8 Seiten, 14 Bilder, 2 Quellen
Aufsatz (Konferenz)
Englisch
AIAA | 1981
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