Adhesive bonding has been matter of research for the last 50 years. This technique permits the design of lighter structures, and thus having more efficient solutions than today's state of the art for joining, riveting. However, the use of paste adhesives requires curing them. Today, this process is carried out by thermal heating at isothermal temperatures recommended by the adhesive supplier, requiring a big amount of energy and time. The acceleration of the curing process by increasing the temperatures is today not considered mainly by the increase of the void formation in the bondline that leads to a decrease of the mechanical performance of the joint. This investigation aims to accelerate the curing process of paste adhesives by the application of a variable temperature process. The approach is based in a void formation model that, once optimized, defines a faster non-isothermal curing cycle keeping the original performance of the joint.
Fast and robust joining process for aerospace components by local heating of paste adhesives
2013
7 Seiten, Bilder, 6 Quellen
Aufsatz (Konferenz)
Datenträger
Englisch
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