As a new composite wall system, because of advanced structure, excellent polystyrene insulation board, insulation effect, light weight, the simple and flexible construction method and well adaptability, polystyrene insulation board thin coating of exterior wall thermal insulation technology is widely used in China. In practical applications, thermal bridges and the board surface cracks that caused by improper handling of deformation joints and detailed structure are the main problem of the technology. In this paper, many problems are analyzed such as the crack causes, the plates overlap and the node structure treatment, and also corresponding solutions are proposed.


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    Titel :

    Crack Analysis and Node Design Improvements for Polystyrene Outer Insulation System


    Beteiligte:
    Liu, Qi-Shun (Autor:in)


    Erscheinungsdatum :

    2012


    Format / Umfang :

    4 Seiten




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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