The Automotive market is showing macro trends of evolution and innovation fueled by two main driving forces: Energy Saving and Safety. The above concepts open new opportunities to integrated technologies that will have an important and growing role in the next future. The paper describes the evolution of 'Smart Power' technologies for Automotive applications that is going both in the direction of microlithography reduction, for added intelligence for monitoring and control, and to added feature to improve Voltage and Current capabilities. Advanced technology nodes down to 0.16 micron are described, with Voltage capability up to 300 V and 800 V. Conventional Junction Isolation is still the mainstream, but SOI and Dielectric Trench Isolation solutions are showing technical benefits and a good tradeoff between performances and cost. High current (10s A), severe energy dissipation requirements, extended life and temperature range are going to require novel metallization schemes and packaging solutions.
Trends in BCD-smart power integrated technologies for high voltage-high current automotive applications
2010
10 Seiten, 9 Bilder, 5 Tabellen, 8 Quellen
(nicht paginiert)
Aufsatz (Konferenz)
Datenträger
Englisch
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