The life time of a component is defined by the reliability demands place on it due to ist operating environment and operation conditions. To evaluate the necessarily thermal power cycle stability of a power semiconductor module in a hybrid electrical vehicle (HEV), a vehicle driving cycle profile is used to calculate the thermal reliability requirements. The calculations are based on power loss calculation, thermal modeling and a general approach of a life cycle model. This paper discusses the reliability requirements due to active and passive thermal stress on various joints such as solder or bond joints resulting by using different connections of a power module to varied cooling systems. In order to make inverter systems more comparable the presented investigations were based on a unified basis-power module and a common set of input parameters. To evaluate the necessarily thermal / power cycle stability of a power semiconductor module in a hybrid electrical vehicle (HEV), a procedure was developed, which computes the temperature of the silicon and the solder over a given driving cycle. By transforming the thermal stress on solder and bond joints due to active and passive thermal stress into reliability test data a calculation of equivalent test cycles was done. In this paper eight different sets of parameter varying in cooling conditions and/or battery voltage were compared. One result was that a joint development between vehicle manufacturer, the inverter supplier and the supplier of the power semiconductor module is very helpful in finding a cost effective solution by adjusting the driving strategy, the cooling system, the battery voltage and the module thermal capabilities.
Reliability of power modules in hybrid vehicles
Zuverlässigkeit von Leistungsmodulen für Hybridfahrzeuge
2009
7 Seiten, 9 Bilder, 4 Tabellen, 17 Quellen
Aufsatz (Konferenz)
Datenträger
Englisch
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