The implementation of microsystems in automotive applications is certainly one of the driving forces for the success of MEMS (microelectromechanical system) as an industrial technology on mass production level. In many cases, automotive systems based on microsensors are critical to safety. Consequently, microsystems have to assure an accurate, reliable, and failsafe operation during the entire lifetime of the vehicle. Since, the car represents a harsh environment for electronic or mechanical systems and components, reliability issues of MEMS have moved more and more into the focus of research and development. In particular, reliability aspects related to packaging and assembly have become a key issue in lifetime investigations. The packaging of microsystems comprises a variety of materials and material combinations, that directly affect the stability of MEMS components. Therefore, sophisticated characterization methods are needed to extract the reliability-relevant material parameters. This paper gives an introduction into investigations of the stability assessment of glass frit bonding as well as new bonding technologies based on metallic sealing of MEMS devices.


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    Titel :

    Reliability aspects of microsystems for automotive applications


    Weitere Titelangaben:

    Zuverlässigkeitsaspekte von Mikrosystemen für Anwendungen im Fahrzeugbau


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    2009


    Format / Umfang :

    8 Seiten, 9 Bilder, 17 Quellen




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch






    Microsystems packaging for automotive applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | Tema Archiv | 2002


    Microsystems Packaging for Automotive Applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | British Library Conference Proceedings | 2002