It is difficult detecting flaws in multi-layered structures such as aircraft fuselage lap splices. Pulsed eddy current (PEC) is an effective method that has been demonstrated to be capable of quantifying such defects. Different from conventional eddy current testing techniques, the exciting coil of PEC is fed by a pulsed waveform, the transient response signal in time domain is analysed, peak amplitude and zero-crossing times are extracted to detect and characterise flaws. PEC is used to quantify cracks found in aircraft structure, with the purpose of overcoming the problem of low accuracy of PEC in the classification of defects. A new feature, namely the frequency spectrum separating point, is proposed for defect classification. Finally, an array PEC imaging method is proposed to detect corrosion appearing in the second layer of aircraft structure.


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    Titel :

    Ultrasonic testing of the diffusion bonding of titanium alloys


    Weitere Titelangaben:

    Ultraschallprüfung von diffusionsgeschweißten Titanlegierungen


    Beteiligte:
    Lin, L. (Autor:in) / Shi, Y.W. (Autor:in) / Chen, J. (Autor:in) / Li, X.M. (Autor:in) / Guo, G.P. (Autor:in)

    Erschienen in:

    Insight ; 48 , 7 ; 415-417


    Erscheinungsdatum :

    2006


    Format / Umfang :

    3 Seiten, 7 Bilder, 9 Quellen




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch




    Brazing and Diffusion Bonding of Titanium Alloys to Similar and Dissimilar Materials

    Bertossa, Robert C. / Hikido, Tsutomu | SAE Technical Papers | 1965


    ULTRASONIC INSPECTION OF TITANIUM ALLOYS

    SAE Technical Papers | 1972


    Low-Pressure Diffusion Bonding of Titanium

    J. F. Kenney / C. Deminet | AIAA | 1979


    Low pressure diffusion bonding of titanium

    KENNEY, J. / DEMINET, C. | AIAA | 1978


    Diffusion bonding of advanced alloys

    Khan, Tahir I. | IEEE | 2013