The influence of the substrate technology, assembly method, and housing material on the thermal, thermo-mechanical and cost performance of a radar module for automotive applications has been studied to address the product reliability aspects during the design phase. Flip chip and wire bonding have been evaluated for Multi-Chip Module - Laminate/Deposition (MCM-L/D) and Multi-Chip Module-Deposition (MCM-D) substrate technologies used for electronic packaging solutions in a harsh environment. Solder ball and direct attachment have been investigated as second-level assembly. As a result of thermal and thermo-mechanical simulations and cost analysis, radar module designs combining MCM-D and MCM-L/D with wire bonding have been revealed, which are preferable for use in different temperature environments with respect to two performance criteria, the maximum junction temperature and the manufacturing cost. Simulation-based guidelines have been developed for designing radar modules used in automotive applications while satisfying temperature and stress constraints provided for the module.
Thermal and thermo-mechanical analysis for design evaluation of an automotive radar module
Quality and Reliability Engineering International ; 20 , 7 ; 709-726
2004
18 Seiten, 17 Quellen
Aufsatz (Zeitschrift)
Englisch
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