The influence of the substrate technology, assembly method, and housing material on the thermal, thermo-mechanical and cost performance of a radar module for automotive applications has been studied to address the product reliability aspects during the design phase. Flip chip and wire bonding have been evaluated for Multi-Chip Module - Laminate/Deposition (MCM-L/D) and Multi-Chip Module-Deposition (MCM-D) substrate technologies used for electronic packaging solutions in a harsh environment. Solder ball and direct attachment have been investigated as second-level assembly. As a result of thermal and thermo-mechanical simulations and cost analysis, radar module designs combining MCM-D and MCM-L/D with wire bonding have been revealed, which are preferable for use in different temperature environments with respect to two performance criteria, the maximum junction temperature and the manufacturing cost. Simulation-based guidelines have been developed for designing radar modules used in automotive applications while satisfying temperature and stress constraints provided for the module.


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    Titel :

    Thermal and thermo-mechanical analysis for design evaluation of an automotive radar module


    Beteiligte:
    Lindgren, Mats (Autor:in) / Belov, Ilja (Autor:in) / Leisner, Peter (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    2004


    Format / Umfang :

    18 Seiten, 17 Quellen




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch




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