The Japanese bans on solders containing lead in mobile communications products have caused the other telecommunication industries to go for lead-free solutions. The lead-free solder used by most telecommunication industries is SnAgCu-solder. This solder has a melting point of about 217 deg C. This indicates that the peak reflow temperature will increase to 250 deg C - 260 deg C, compared to the peak reflow temperature of 215 deg C - 230 deg C with PbSn-solder. The increased solder reflow temperature will cause thicker intermetallics (SnCu and SnNi).This will have a negative effect on long term reliability, especially for harsh applications like under hood electronics in cars which will be shown. The increased retlow temperature can give reliability problems for plastic packages and for PCBs used in harsh environments.


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    Titel :

    Lead free soldering, reliability risks in harsh environments


    Beteiligte:
    Danielsson, H. (Autor:in)


    Erscheinungsdatum :

    2003


    Format / Umfang :

    6 Seiten, 4 Bilder, 13 Tabellen, 9 Quellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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