The Japanese bans on solders containing Lead in mobile telecommunication products have caused the other telecommunication industries to go for Lead-Free solutions. The Lead-Free solder used by most telecommunication industries is SnAgCu-solder (95,8Sn3,5 Ag0,7Cu). This solder have a melting point of about 217 °C. This indicate the reflow temperature will increase by 30-40 °C, compared to the reflow temperature of the to day most used solder. (63Sn37PB with melting point 183 °C)The increased solder reflow temperature will cause more intermetallics between Sn in the solder and Cu on the PCBs for example. This will have a negative effect on the long term reliability, especially for harsh applications as Power Train Electronics.The increased reflow temperature will also increase the Pop Corn problem of IC-plastic packages, especially packages used in harsh environments. This can have a very negative effect on the long term reliability for system working in harsh environments.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Reliability Risks with Lead-Free Soldering and Possible Solutions


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    SAE 2002 World Congress & Exhibition ; 2002



    Erscheinungsdatum :

    2002-03-04




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Reliability Risks with Lead-Free Soldering and Possible Solutions

    Danielsson, H. / Society of Automotive Engineers | British Library Conference Proceedings | 2002



    Lead-free laser soldering of an avionic component

    Lima, M.S.F. / Riva, R. / Silva, R.A. jun. et al. | Tema Archiv | 2007


    Lead-free and no-clean soldering for automotive electronics

    Shangguan, D. / Gao, G. | Tema Archiv | 1997


    Robust Optimization of a Lead‐Free Reflow Soldering Process

    Chowdhury, Subir ;Taguchi, Shin | Wiley | 2016