Micro-Mechatronics and System Integration is a multidisciplinary field, which offers low cost system solutions based on the principle of homogenizing system components and consequent elimination of at least one material, component or packaging level from the system. These system approaches show, compared to the existing solutions, a higher functionality, more intelligence and better reliability performance. The number of interconnects necessary to link a motor, sensor, or an actuator to a digital bus decreases, as the smartness of the devices increases. The paper presents problem definitions and solutions for optical devices using micro-mirror reflector technology for mechatronic systems. To reduce package volume, advanced packaging technologies as Flip Chip and CSP could be used, for increased reliability and additional mechanical functionality encapsulation processes as transfer-molding, a combination of transfer- and injection molding are recommended. The mechatronic packaging will be discussed in detail. Especially cost, reliability performance and according 'Design for Reliability' show the potential of micro-mechatronic solutions in automotive and industrial applications.
Micro-opto-electro-mechanical-systems (MOEMS) in automotive applications
Ein mikro-optoelektronisch-mechanisches System für fahrzeugspezifische Anwendungen
2002
11 Seiten, 5 Bilder, 1 Tabelle, 9 Quellen
Aufsatz (Konferenz)
Englisch
Micro-Opto-Electro-Mechanical-Ssystems (MOEMS) in Automotive Applications
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