One limiting parameter for the application of MEMS in cars at places with elevated temperatures is the interconnect and wiring system of these devices. Currently used materials and technological concepts often are not sufficient for temperatures far above 125 Cel. This article attempts at first, to reflect main problems of device metallization at high temperatures. Finally, two application specific interconnect and wiring concepts are briefly introduced, which are able to work at temperatures up to 400 Cel and up to 500 Cel, respectively.


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    Titel :

    Interconnect systems in automotive sensors at elevated temperatures


    Weitere Titelangaben:

    Steckersysteme fahrzeugspezifischer Sensoren für höhere Temperaturbereiche


    Beteiligte:
    Gottfried, K. (Autor:in) / Gessner, T. (Autor:in) / Kaufmann, C. (Autor:in)


    Erscheinungsdatum :

    2003


    Format / Umfang :

    11 Seiten, 7 Bilder, 3 Tabellen, 14 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Interconnect systems in automotive sensors at elevated temperatures

    Gottfried, K. / Kaufmann, C. / Gessner, T. | Tema Archiv | 2004


    Interconnect Systems in Automotive Sensors at Elevated Temperatures

    Gottfried, K. / Gessner, T. / Kaufmann, C. | British Library Conference Proceedings | 2003


    Flexible interconnect systems for automotive applications

    Belopolsky,Y. / Killian,C. / Du Pont,US | Kraftfahrwesen | 1991