The classical partitioning of control devices for drive, chassis, security and bodyshell/comfort electronics leads to a subdivision into logic memory, supply, power output stages, bus drivers and sensor/input signal processing. Light-emitting and sensing components round off today's applications. For newly emerging applications from the driver information systems sector, such as navigation and telematics, these are joined by additional classes, including GSM, GPS, graphics controllers, and a wide range of applications from the multimedia sector with their additional wireless communication interfaces. The paper ist divided in the following parts memory, logic, radio frequency, sensor, power semiconductor, optical fiber technologies and optosemiconductors.


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    Titel :

    Semiconductor technologies for the automotive electronics of the future


    Weitere Titelangaben:

    Halbleitertechnologien für die künftige Elektronik im Fahrzeug


    Beteiligte:
    Eschert, C. (Autor:in) / Hoika, J. (Autor:in) / Sirch, O. (Autor:in) / Täuber, R. (Autor:in) / Venmann, M. (Autor:in)


    Erscheinungsdatum :

    2000


    Format / Umfang :

    15 Seiten, 20 Bilder, 1 Tabelle, 8 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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