Electronic devices for automotive electronic applications have to be operated under extreme environmental conditions and therefore are required to have higher reliability compared with general electronic equipment. Recently automotive voltage regulators, ignition systems, etc. have been changing from mechanical constructions to electronic using thick tilm technology. The authors' present result shows that flip chip IC technology can satisfy the high reliability requirements of automobile electronics.


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    Titel :

    Reliability considerations of flip chip components for automotive electronic applications


    Weitere Titelangaben:

    Zuverlaessigkeitsueberlegungen von Flipchipkomponenten fuer Anwendungen in der Automobilelektronik


    Beteiligte:
    Sugiyama, K. (Autor:in) / Bansaku, I. (Autor:in) / Tsuzimoto, N. (Autor:in) / Tachikawa, I. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1981


    Format / Umfang :

    6 Seiten, 3 Quellen


    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch




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