The installation of electronic circuitry in modern automobiles is following a rapidly increasing pattern. Those units are exposed to environmental conditions of the most stringent nature and therefore special consideration has to be given to the packaging technology. Because of their unique property profile, silicone potting and encapsulating materials have established themselves as the ideal protective media for car electronic systems. An entirely new family of HIPEC silicone self priming elastomers will also be described. Application cases of on-board electronic packaging will be discussed including potting of modules with flexible encapsulants and coatings of printed circuit-boards. A separate section will be devoted to the protection of hybrid circuits for under-bonnet use. The increased complexity of hybrids has created specific needs for products such as high purity 'blob coatings' for naked semi-conductor protection; flexible thermally conductive adhesives to provide a compliant bond between the ceramic substrate and metal heat sink; stress relieving encapsulation materials and finally, high strength yet flexible structural adhesives to assemble dissimilar materials like plastics and metals.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen


    Exportieren, teilen und zitieren



    Titel :

    New silicone materials for reliable packaging


    Weitere Titelangaben:

    Neue Silizium-Materialien fuer den zuverlaessigen Geraetebau


    Beteiligte:
    Paquet, R.L. (Autor:in)


    Erscheinungsdatum :

    1985


    Format / Umfang :

    5 Seiten, 8 Quellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Silicone materials for electronic packaging

    Gensler,G. | Kraftfahrwesen | 1990


    New silocone materials for reliable packaging

    Paquet,R.L. / Dow Corning Europe,R and D Speciality Elastomers,BE | Kraftfahrwesen | 1985


    Electronics packaging for high reliable piezoactuators

    Oppermann, M. / Lenk, A. / Schonecker, A. et al. | Tema Archiv | 2007


    Silicone system choices abound for HB LED packaging

    Riegler, B. / Thomaier, R. / Bruner, S. | British Library Online Contents | 2006