With the variety of electronic applications (ignition control, fuel control, anti-skid brake controls, accessory controls, instrumentation and entertainment systems) and the volume of the mgenerated, the automotive industry will benefit substantially by adopting surface mount assembly. The industry will be able to add sophisticated features to its products at significantly lowercost when compared with the traditional electronic assembly techniques. Cost savings will be realized through automation and reduction in physical facility requirements and materials costs. And, the key to this technology is the emergence of the semiconductor in miniaturized, surface mount packages.


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    Titel :

    Semiconductor packages for the 80's


    Weitere Titelangaben:

    Halbleiter-Bauteile fuer die 80-er Jahre


    Beteiligte:
    Bowlby, R. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1983


    Format / Umfang :

    5 Seiten, 3 Bilder, 1 Tabelle


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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