J.M.K. Horwood: Molybdenum-gold conductors for nickel chromium alloy thin film resistors(268-268). --D.J. Dean: A quick method for the accurate evaluation of temperatures arising from heat sources having a rear heat sink(269-273). --B.E. Taylor, J.J. Felten, J.R. Larry: Progress in and technology of low cost silver containing thick film conductors (274-286). --D.S. Brown: The development of a hermetic integral (287-290). --R.E. Cooper, R.F.E. Jenkins: A novel thick film microwave package(291-294). --J.M. Ironside, P.W.R. Stubbs: Continuosly variable transmission control (295-302). --P.G. Barnwell: Is there a place for thick film hybrids in automobile electronics?(303-305). --B. Rivers: Electronic systems for vehicles(306-309). --C.J. Heslop: Plasma etching(310-314). --J. Meleham: Current trends in I.C. metallisation(315-319)
Proc. of the tech. programme, internepcon U.K.'80, int. electronic packing and production conferences; Brighton, Oct. 14-16, 1980; GB; (Part. 6)
Verhandlungen zum technischen Programm der internationalen Elektronikverpackungs- und Herstellungskonferenzen Internepcon U.K.'80 in Brighton, GB, vom 14.-16.10. 1980; (Teil 6)
1980
52 Seiten
Aufsatz (Konferenz)
Englisch
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