An ergonomics study and design of Ceramic Column Grid Array (CCGA) grinding using hand operation are performed. A systemic CCGA grinding process procedure is developed. First, the typical grasp method of CCGA chip is defined. Eleven points in chip are selected. Second, the operation order of grinding parts are designed and the grinding times is also proposed. The common grinding order is the front part, middle part, and back part of the CCGA chip; and the grinding time should be large than 3. Third, two indices are considered to evaluate the grinding operation effect, i.e., the grinding time and CCGA flatness degree. The CCGA flatness degree can also be used for grinding effect evaluation (rather than the grinding operation effect). Many experiment results have shown that the proposed grinding method can improve the grinding effect and quality stability of CCGA chip.


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    Titel :

    Hand Operation Ergonomics Study and Design of CCGA Grinding Process


    Weitere Titelangaben:

    Lect. Notes Electrical Eng.


    Beteiligte:
    Long, Shengzhao (Herausgeber:in) / Dhillon, Balbir S. (Herausgeber:in) / Liu, Haoting (Autor:in) / Ge, Jianyue (Autor:in) / Wang, Yuan (Autor:in) / Wang, Shengjie (Autor:in) / Lin, Pengrong (Autor:in) / Yang, Shaohua (Autor:in) / Wang, Duming (Autor:in)

    Kongress:

    International Conference on Man-Machine-Environment System Engineering ; 2022 ; Beijing, China October 21, 2022 - October 23, 2022



    Erscheinungsdatum :

    2022-08-21


    Format / Umfang :

    7 pages





    Medientyp :

    Aufsatz/Kapitel (Buch)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch