Abstract During the funding project EmPower a new embedding concept was developed for integration of power components. The embedding technology shows promising potential for automotive applications regarding high miniaturization potential as well as good electrical and thermal performance. Additionally the concept provides good reflow stability and thermal shock behavior. This could be realized with the demonstrators of the EmPower project and single chip test vehicle for deeper investigation of the potentials of this embedding technology according AEC-Q101 requirements. High robustness on power cycling was an outstanding exploration result.


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    Titel :

    Powering Up Electronics—Latest Developments and Concepts for Packaging of Electronics in Automotive Systems


    Beteiligte:
    Stahr, Johannes (Autor:in) / Morianz, Mike (Autor:in)


    Erscheinungsdatum :

    01.01.2019


    Format / Umfang :

    9 pages





    Medientyp :

    Aufsatz/Kapitel (Buch)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch







    Focus on electronics - latest developments in electronics and mechatronics in the automotive world

    Kimberley,W. / Delphi Energy and Engine Management Systems,US / Bosch,Stuttgart,DE et al. | Kraftfahrwesen | 1998


    Developments in automotive electronics

    Westbrook,M.H. / Ford Motor,GB | Kraftfahrwesen | 1979