This paper presents a fiber optic packaging technique using qualifiable materials and processes that has been developed for space applications. The technique is consistent with a Multi Chip Module implementation. This packaging technique allows multiple fiber optic interfaces to be combined with high density electronics within a single easily integrable package and can be used wherever fiber optics are incorporated into spaceborne systems, including the Fiber Optic Data Bus, the Space Station FDDI interface, any upgrades of the Space Station Local Bus from 1553 to 1773, and various Dual Rate 1773 applications.
Fiber optic MCM for spaceborne applications
Photonics for Space Environments II ; 1994 ; Orlando,FL,United States
Proc. SPIE ; 2215
1994-06-08
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Fiber optic MCM for spaceborne applications
Tema Archiv | 1994
|Spaceborne Fiber Optic Data Bus (SFODB)
NTIS | 1998
|Spaceborne Fiber Optic Data Bus (SFODB)
NTRS | 1999
|Spaceborne Fiber Optic Data Bus (SFODB)
NTIS | 1999
|Spaceborne Fiber Optic Data Bus (SFODB)
NTIS | 2008
|