A paper was presented at the 1986 SAE congress which accounted in part, for the variability in physical property performance within injection molded instrument panel carriers. As a continuation of that paper we developed two test molds to allow us to make a more fundamental examination of weld lines. One of these is a 76.2 × 101.6 mm flat test chip which is double gated to form a well defined weld line. This has enabled us to measure physical properties (including impact strength) of the weld line as a function of materials and molding conditions. Apparent color variations across the the weld line as a function of polymer morphology was studied as was paintability. The second mold, a boss testing tool, has allowed us to study the weld lines which form on the downstream side of these functionally important fastening points.


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    Titel :

    Instrument Panel Performance- An Applications Approach-Part 2


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    SAE International Congress and Exposition ; 1987



    Erscheinungsdatum :

    1987-02-01




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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    Instrument Panel Performance Analysis-An Applications Approach

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    Instrument panel performance analysis - An applications approach

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