The wide variety of available leadless electronic components is described. Some typical applications of these devices are illustrated. The advantages to be gained through the use of these surface mounted devices are explained. These include reduced size, increased reliability, improved performance and reduced cost. Methods of application, including automatic assembly equipment, are discussed. Several applicable soldering processes are explained.


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    Titel :

    Worldwide Status of Leadless Component Assembly Technology


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    International Congress on Transportation Electronics ; 1982



    Erscheinungsdatum :

    1982-02-01




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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