This recommended practice describes the materials, related equipment, and particular processing techniques utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix "A" to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures. ARP1927 has been reaffirmed to comply with the SAE Five-Year Review policy.


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    Titel :

    Application of Direct Pressure to Resin in Curing of Epoxy and Addition Type Polyimides


    Erscheinungsdatum :

    07.06.2022



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    High-Flow, High-Molecular-Weight, Addition-Curing Polyimides

    Chuang, Kathy C. / Vannucci, Raymond D. | NTRS | 1993


    Addition-type polyimides from solutions of monomeric reactants

    Delvigs, Peter / Serafini, Tito T. / Lightsey, George R. | TIBKAT | 1972




    Tougher Addition Polyimides Containing Siloxane

    St. Clair, T. L. / Maudgal, S. | NTRS | 1986