This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid. The test method for volume resistivity is being updated to permit use of MIL-STD-883, Method 5011.6 since the incumbent ASTM D257 provides no test method for conductive adhesives.
Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
13.07.2017
Aufsatz (Konferenz)
Englisch
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