The goal of this program is to utilize the recently developed high conductivity carbon foam for thermal management in electronics (heat exchangers and heat sinks). The technique used to fabricate the foam produces mesophase pitch-based graphitic foam with extremely high thermal conductivity and an open-celled structure. The thermal properties of the foam have been increased by 79% from 106 to 187 W/m·K at a density of 0.56 g/cm3 through process optimization. It has been demonstrated that when the high-thermal-conductivity graphitic foam is utilized as the core material for the heat exchanger, the effective heat transfer can be increased by at least an order of magnitude compared to traditional designs. A once-through-foam core/aluminum-plated heat exchanger has been fabricated for testing in electronic modules for power inverters.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Graphitic Foam Thermal Management Materials for Electronic Packaging


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Walls, Claudia (Autor:in) / Klett, James (Autor:in) / Klett, Lynn (Autor:in) / Burchell, Tim (Autor:in)

    Kongress:

    Future Car Congress ; 2000



    Erscheinungsdatum :

    2000-04-02




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Graphitic foam thermal management materials for electronic packaging

    Klett,J. / Klett,L. / Burchell,T. et al. | Kraftfahrwesen | 2000


    Nonlinear deformation of graphitic materials

    Jones, R. / Nelson, D. | Tema Archiv | 1975


    Microcellular graphitic carbon foams for next generation structures and thermal management

    Anderson, D.P. / Kearns, K.M. / Klett, J.W. et al. | IEEE | 2000


    Microcellular Graphitic Carbon Foams for Next Generation Structures and Thermal Management

    Anderson, D. P. / Kearns, K. M. / Klett, J. W. et al. | British Library Conference Proceedings | 2000