This specification covers a two-component compound, an epoxy resin base and a hardener in the form of a paste.
ADHESIVE COMPOUND, EPOXY Medium Temperature Application
01.04.1986
Aufsatz (Konferenz)
Englisch
ADHESIVE COMPOUND, EPOXY Medium Temperature Application
SAE Technical Papers | 1993
ADHESIVE COMPOUND, EPOXY Medium Temperature Application
SAE Technical Papers | 1960
Adhesive Compound, Epoxy Medium Temperature Application
SAE Technical Papers | 1995
ADHESIVE COMPOUND, EPOXY High Temperature Application
SAE Technical Papers | 1960
ADHESIVE COMPOUND, EPOXY High Temperature Application
SAE Technical Papers | 1986