Modular building blocks are used to configure VSCF converters of ratings varying from 40 to 110 kVA using an unvarying geometry for uniform circuit impedances. Rating changes are made via choice of transistor rating and by adjustment of the capacitive and inductive filter elements. The modular commonality greatly reduces development lead time and technical risk for new systems as well as reducing spares inventories and maintenance training.This paper describes the various modules and shows how rating changes are implemented. Alternate cooling means such as air or oil are discussed along with a description of physical adjustments necessary for cooling compatibility. Weight, size, and efficiency data are presented for all ratings and cooling methods.


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    Titel :

    Modular Packaging of VSCF Converters


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    Aerospace Technology Conference and Exposition ; 1987



    Erscheinungsdatum :

    1987-10-01




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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