INORGANIC ADHESIVE BONDING FOR FUNCTIONAL TEMPERATURES UP TO 5000°F
Sae Technical Papers
Pre-1964 SAE Technical Papers ; 1906
01.01.1960
Aufsatz (Konferenz)
Englisch
Extrusion at temperatures approaching 5000° F
TIBKAT | 1965
|Extrusion at Temperatures Approaching 5000 Deg F
NTIS | 1965
|NAT 5000 - Nakashima Advanced Virtual Tank 5000
TIBKAT | 2020
|DataCite | 1941
Katalog Agrar | 1977
|