This specificiation covers a filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.Cancel due to inaccurate technical requirements.
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
22.09.2016
Aufsatz (Konferenz)
Englisch
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
SAE Technical Papers | 1993
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
SAE Technical Papers | 1981
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
SAE Technical Papers | 1986
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
SAE Technical Papers | 1991
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Machinable
SAE Technical Papers | 2016