Surface Mount Technology (SMT) is a high-productivity and cost-effective circuit board assembly method used extensively in the consumer electronics industry. Regulations requiring lead-free solder have pushed the peak processing temperatures of SMT to as high as 270°C. This has resulted in the need for higher temperature performance from contact and circuit insulation. Considering the rise in infotainment content on vehicles, many onboard devices already employ the lead-free SMT process. The use of lead-free SMT processes now extends to the data and control circuit devices of safety, powertrain and other vehicle electronics.Polyamide 4T is a proven performer in lead-free solder SMT applications, namely connectors in the consumer and industrial electronics industries. The use of polyamide 4T naturally translates to traditional and emerging automotive electronics applications.Using polyamide 4T in lead-free SMT processes allows a design engineer to realize additional benefits of stable electrical properties, low warp, good dimensional stability, and the ability to design in environments with USCar Class 4 and higher continuous operating temperatures.With higher thermal, chemical and mechanical demands being placed on components in the engine compartment there will be an increasing demand for higher performance resins in electronics applications.Performance data will be given showing why polyamide 4T is the low risk choice compared to other high heat resins for automotive electronic SMT applications.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Advances in Polyamide 4T for Lead Free Solder Surface Mount Technology (SMT) Applications


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    SAE 2013 World Congress & Exhibition ; 2013



    Erscheinungsdatum :

    2013-04-08




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch





    LEAD-FREE SOLDER COMPOSITION

    HWANG JENNIE S / PEREIRA JOHN / MACKIN ALEXANDRA MARY et al. | Europäisches Patentamt | 2017

    Freier Zugriff

    Lead-free solder composition

    HWANG JENNIE S / PEREIRA JOHN / MACKIN ALEXANDRA MARY et al. | Europäisches Patentamt | 2018

    Freier Zugriff