Parts made from phenolic molding materials must be postcured to promote the thorough crosslinking required for end usage at temperatures above about 175°C. Since the time and energy used in postcuring can represent about ten percent of part cost, efficient postcuring offers significant potential savings.Based on a kinetic description of the phenolic crosslinking reaction, we have developed a computer model to predict the development of the glass transition during postcure. This model provides a convenient CAD tool for minimizing postcuring costs.


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    Titel :

    Computer Modelling of Phenolic Postcure


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Fitts, Bruce B. (Autor:in) / Arimond, John (Autor:in) / Landi, Vincent R. (Autor:in)

    Kongress:

    SAE International Congress and Exposition ; 1987



    Erscheinungsdatum :

    1987-02-01




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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