This paper describes the development and testing status of several novel components and integration tools for space-based cryogenic applications. These advanced devices offer functionality in the areas of cryogenic thermal switching, cryogenic thermal transport, cryogenic thermal storage, and cryogenic integration. As such, they help solve problems associated with cryocooler redundancy, across-gimbal thermal transport, large focal plane array cooling, fluid-based cryogenic transport, and low vibration thermal links. The devices discussed in the paper include a differential thermal expansion cryogenic thermal switch, an across-gimbal thermal transport system, a cryogenic loop heat pipe, a cryogenic capillary pumped loop, a beryllium cryogenic thermal storage unit, a high performance flexible conductive link, a kevlar cable structural support system, and a high conductance make-break cryogenic thermal interface.


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    Titel :

    Advanced Components and Techniques for Cryogenic Integration


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Marland, B. (Autor:in) / Tomlinson, B. (Autor:in) / Stouffer, C. (Autor:in) / Bugby, D. (Autor:in) / Davis, T. (Autor:in)

    Kongress:

    31st International Conference On Environmental Systems ; 2001



    Erscheinungsdatum :

    2001-07-09




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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    Advanced Components for Cryogenic Integration

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