This paper describes the latest Fluorescent Indicator Panel (FIP) technology, featuring integrated circuits mounted within the vacuum envelope on the glass substrate. This is called Chip-in-Glass FIP, or CIG FIP. The discussion includes basic technologies, design flexibility, reliability, and driver ICs.
Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications
Sae Technical Papers
SAE International Congress and Exposition ; 1987
1987-02-01
Aufsatz (Konferenz)
Englisch
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