The importance of electromagnetic compatibility (EMC) in electronic systems becomes emphasized as interference problems of increasingly serious nature appear. Packaging to avoid electromagnetic interference effects can provide the major suppression capability in a system.A number of general packaging techniques covering magnetic and electric field suppression, and the avoidance of “common impedance” interference, are presented. Techniques are considered for the three major EMC areas of a system: the sources of interference, the transmission media, and the equipments which react erroneously when interference is present. The need for education in EMC as an integral part of an engineer's training is also emphasized.


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    Titel :

    Packaging for Electromagnetic Compatibility


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    Electronic Packaging Conference ; 1967



    Erscheinungsdatum :

    1967-02-01




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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