The lifetime of an AMTEC electrode is predicted from the rate of grain growth in the electrode. The rate of growth depends on several physical characteristics of each material, including the rate of diffusion of the material on itself. Grain growth rates for rhodium-tungsten and titanium nitride electrodes have been determined, and have been used to predict operating lifetimes of AMTEC electrodes. For lifetimes of 10 years or more, RhxW electrodes may be used at any operating temperature supportable by the electrolyte. TiN electrodes may be used in AMTEC cells only at operating temperatures under 1150 K.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Lifetimes of AMTEC Electrodes: Rhodium-Tungsten and Titanium Nitride


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Lara, L. (Autor:in) / Ryan, M. A. (Autor:in) / Homer, M. L. (Autor:in) / Cortez, R. H. (Autor:in) / Williams, R. M. (Autor:in) / Shields, V. B. (Autor:in)

    Kongress:

    34th Intersociety Energy Conversion Engineering Conference ; 1999



    Erscheinungsdatum :

    02.08.1999




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch


    Schlagwörter :


    Lifetimes of AMTEC electrodes: rhodium-tungsten and titanium nitride

    Ryan,M.A. / Shields,V.B. / Cortez,R.H. et al. | Kraftfahrwesen | 1999


    Lifetimes of AMTEC electrodes: Molybdenum, rhodium-tungsten, and titanium nitride

    Ryan, M. A. / Shields, V. B. / Cortez, R. H. et al. | American Institute of Physics | 2000


    Lifetimes of AMTEC Electrodes: Molybdenum, Rhodium-Tungsten, and Titanium Nitride

    Ryan, M. A. / Shields, V. B. / Cortez, R. H. et al. | British Library Conference Proceedings | 2000


    Lifetimes of Thin AMTEC Electrodes

    Ryan, M. / Kisor, A. / Williams, R. et al. | British Library Conference Proceedings | 1994


    Lifetimes of thin film AMTEC electrodes

    Ryan, M. / Kisor, A. / Williams, R. et al. | AIAA | 1994