The diffusion phenomena of tin and indium which are contained in the lead-base overlay of 3-layer copper-lead alloy bearings were studied. Easier diffusion of tin compared with indium decreases the corrosion resistance of the overlay, and the tin reacts with the underlayer to form brittle Ni-Sn or Cu-Sn intermetallic compound, resulting in weak bonding strength.Addition of copper into Pb-In overlay markedly restrains the diffusion of indium and therefore stabilizes the characteristics of corrosion resistance, bonding strength and mechanical properties for a long period. Cavitation tests, seizure tests and bearing fatigue tests were conducted on Pb-In-Cu overlay to study the feasibility of its application to actual engine bearings.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Diffusion Behavior of Overlay for Three Layers Engine Bearings


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Sakamoto, Masaaki (Autor:in) / Wada, Motomu (Autor:in) / Ogita, Yukio (Autor:in)

    Kongress:

    SAE International Congress and Exposition ; 1989



    Erscheinungsdatum :

    01.02.1989




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Diffusion behavior of overlay for three layers engine bearings

    Sakamoto,M. / Wada,M. / Ogita,Y. et al. | Kraftfahrwesen | 1989


    Development of Engine Bearings with Solid Lubricant Overlay

    Kawagoe, K. / Kanayama, H. / Desaki, T. et al. | British Library Conference Proceedings | 2001


    Studies on Lead-free Resin Overlay for Engine Bearings

    Ono, Akira / Iwata, Hideki / Sugimura, Hiromitsu et al. | SAE Technical Papers | 2006


    Studies on lead-free resin overlay for engine bearings

    Tanaka,T. / Naka,I. / Abe,T. et al. | Kraftfahrwesen | 2006


    Friction and Wear Reduction of Engine Bearings with Solid Lubricant Overlay

    Kamiya, Shu / Desaki, Toru / Chitose, Toshiyuki et al. | SAE Technical Papers | 2014