A miniature heat pipe constructed from a multi-layered, co-fired ceramic process utilizing brazed-on evaporator and condenser slugs is investigated. The substrate-embedded heat pipe is shown to effectively dissipate the heat generated by a power MOSFET, used as the heat source, while maintaining a nearly constant junction temperature over a power load range from 6 to 10 watts. Independent modeling of the evaporation, vapor flow, condensation, and capillary flow are used to guide the heat pipe development. Predicted operation and experimental operation of the heat pipe are compared.
Miniature Embedded Heat Pipes in Low Temperature Co-Fired Ceramic for Electronic Devices Requiring Temperature Stability
Sae Technical Papers
Power Systems Conference ; 2000
31.10.2000
Aufsatz (Konferenz)
Englisch
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