High-density electronics packaging requires new advancement in thermal management. New efforts to standardize three-dimensional electronics packages provide the opportunity to standardize thermal management systems for the first time. Microchannel cooling, a high heat flux technology, is the leading candidate for standardization of earth- and space- based electronics packages. This paper looks at the developments in microchannel cooling that make it more advantageous than other high heat flux techniques and the work that remains to achieve a standardized thermal management system.


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    Titel :

    The Evolution of Microchannel Heat Transfer


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    Aerospace Power Systems Conference ; 1999



    Erscheinungsdatum :

    1999-04-06




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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