This paper reviews the current status of MEMS packaging technology from COTS to specific application provides lessons learned, and finally, identifies a need for systematic approach for this purpose.


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    Titel :

    Reliability Issues of COTS MEMS for Aerospace Applications


    Beteiligte:
    Kim, N. (Autor:in) / Ghaffarian, R. (Autor:in) / Ramesham, R. (Autor:in)

    Erscheinungsdatum :

    01.01.1999


    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch




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