The High Performance Spaceflight Computing (HPSC) multi-core processor Chiplet will provide a nearly two orders-of-magnitude improvement above the current state of the art for spaceflight processors, while also providing an unprecedented flexibility to tailor performance, power consumption, and fault tolerance to meet widely varying mission needs. These advancements will provide game changing improvements in computing performance, power efficiency, and flexibility, which will significantly improve the onboard processing capabilities of future NASA and Air Force space missions. HPSC is funded by NASA's Space Technology Mission Directorate (STMD), Science Mission Directorate (SMD), and the United States Air Force. The HPSC project is managed by Jet Propulsion Laboratory, and the HPSC contract is managed by NASA Goddard Space Flight Center (GSFC). Within the HPSC project, Boeing is under contract to NASA to develop prototype Chiplets, system software, and evaluation boards. As another development within the project, NASA Goddard Space Flight Center (GSFC) and the Jet Propulsion Laboratory (JPL) are developing middleware that will simplify application development for HPSC-based onboard processors.


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    Titel :

    High-Performance Spaceflight Computing (HPSC) Project Overview


    Beteiligte:

    Kongress:

    Radiation Hardened Electronics Technology Conference (RHET) 2018 ; 2018 ; Phoenix, AZ, United States


    Erscheinungsdatum :

    2018-11-05


    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch