This viewgraph presentation reviews NASA's Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission needs. The NEPP Program focuses on the reliability aspects of electronic devices. Three principal aspects to this reliability: (1) lifetime, (2) effects of space radiation and the space environment, and (3) creation and maintenance of the assurance support infrastructure required for success.
NASA Electronic Parts and Packaging (NEPP) Program
IEEE Nuclear and Space Radiation Effects conference (NSREC)
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2008
;
Tucson, AZ, United States
Components for Military and Space Electronics (CMSE) conference
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2008
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San Diego, CA, United States
Hardened Electronics and Radiation Technology (HEART) conference
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2008
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Colorado Springs, CO, United States
Single Event Effects Symposium (SEESYM)
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2008
;
Long Beach, CA, United States
2008-02-11
Aufsatz (Konferenz)
Keine Angabe
Englisch
NASA Electronic Parts and Packaging (NEPP) Program
NTIS | 2008
|State of NEPP NASA Electronic Parts & Packaging Program
NTIS | 2020
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