Procedure devised to improve repair of hole through nickel-alloy layer and nickel layer that are parts of larger structure, and separated by thin gap. Involves established techniques of electroforming, grinding, filling, and masking. Conductive coat serves as weak fracture layer between repaired layers.


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    Titel :

    Electroforming Repair Of Adjacent Unconnected Layers


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    01.09.1992



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


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