Procedure devised to improve repair of hole through nickel-alloy layer and nickel layer that are parts of larger structure, and separated by thin gap. Involves established techniques of electroforming, grinding, filling, and masking. Conductive coat serves as weak fracture layer between repaired layers.
Electroforming Repair Of Adjacent Unconnected Layers
NASA Tech Briefs ; 16 , 9
01.09.1992
Sonstige
Keine Angabe
Englisch
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