New trenched lid intercepts less radiation from edges of growing silicon ribbon, giving rise to faster growth and temperature distribution resulting in lower residual stress. Cutting trench in susceptor lid allows edges of growing ribbon of silicon to cool more rapidly. Edges cool and solidify nearly same rate as center of ribbon, and thermal stress in ribbon reduced. Because of more-effective edge cooling, wider ribbon grown, and withdrawn at faster rate. Productivity of dendritic-web growth furnace increased.


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    Titel :

    Reduction Of Stresses In Growing Silicon Webs


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    01.08.1989



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :