Melt-processable polyimides maintain desirable polymer properties prepared by adding small amounts of certain low-molecular-weight, thermally stable additives. Useful in preparing void-free polyimide composites from higher flow resins that wet out fibers at lower processing temperatures. Applied to preparing high-temperature polyimide adhesives allowing enhanced wetting of adherends and ultimately better adhesion. Improvement to processing polyimides and potential application for production of films, coatings, adhesives, and composites.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen


    Exportieren, teilen und zitieren



    Titel :

    Additives Improve Processing Of Polyimides


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    1988-11-01



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    Additives Lower Dielectric Constants Of Polyimides

    Stoakely, Diane M. / St. Clair, Anne K. / Emerson, Burt R., Jr. et al. | NTRS | 1990


    Additives Lower Pickup Of Moisture By Polyimides

    St. Clair, Terry L. / Singh, Jag J. / Pratt, J. Richard | NTRS | 1989


    Metal-Ion Additives Reduce Thermal Expansion Of Polyimides

    Stoakley, Diane M. / St. Clair, Anne K. / Emerson, Burt R., Jr. et al. | NTRS | 1994


    Low-Dielectric Polyimides

    St. Clair, Anne K. / St. Clair, Terry L. / Winfree, William P. et al. | NTRS | 1989


    Rigid-Rod Polyimides

    Online Contents | 1996