Adhesive sealing, nickel plating, and multiwire boards evaluated. Based on study involving fully developed hardware, report considers adhesive packaging instead of seam welding, nickel-plated Kovar (commercial Fe/NI/Co alloy) packages instead of gold plates ones, and multiwire circuit boards instead of multilayer boards as alternatives for reducing cost of hardware without reducing reliability.
Low-Cost Alternatives in Hybrid Microcircuit Packaging
NASA Tech Briefs ; 7 , 4
1983-10-01
Sonstige
Keine Angabe
Englisch
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