Adhesive sealing, nickel plating, and multiwire boards evaluated. Based on study involving fully developed hardware, report considers adhesive packaging instead of seam welding, nickel-plated Kovar (commercial Fe/NI/Co alloy) packages instead of gold plates ones, and multiwire circuit boards instead of multilayer boards as alternatives for reducing cost of hardware without reducing reliability.


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    Titel :

    Low-Cost Alternatives in Hybrid Microcircuit Packaging


    Beteiligte:
    Caruso, S. V. (Autor:in) / Champion, V. L. (Autor:in) / Bassett, R. N. (Autor:in) / Gayer, J. N. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1983-10-01



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    Reliability of hybrid microcircuit bonding

    Caruso, S. V. / Kinser, D. L. / Graff, S. M. et al. | NTRS | 1976


    A Novel Approach to Microcircuit Interconnection and Packaging

    Cohen, Norman I. | SAE Technical Papers | 1965


    Hybrid Microcircuit Design and Procurement Guide

    J. W. Thornell / W. A. Fahley / W. L. Alexander | NTIS | 1970


    Microcircuit-cleaning machine

    Robinson, W. W. / Williamson, J. C. | NTRS | 1978


    Microcircuit photography technique

    Dahms, D. / Slaughter, B. | NTRS | 1977