Tests during processing show way to reduce breakage and increase yield. Silicon wafer twisted by four equally spaced dowel pins, two pushing up and two pushing down. Uniform shear stress found along line 45 degrees from axes of two load pairs. Test helping to develop reliable information on nature and source of flows causing cell fracture.


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    Titel :

    Fracture Strength of Silicon Solar Cells


    Beteiligte:
    Chen, C. P. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1983-10-01



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


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