New tool enters narrow gap between fragile materials and removes adhesively bonded filler without damage to adjacent surfaces. Reaches deep into narrow crevices to reach hidden bond lines. Tool originally developed to remove ceramic filler from between Space Shuttle surface-insulation tiles.
Tool Severs Hidden Adhesive Bonds
NASA Tech Briefs ; 7 , 2
01.05.1983
Sonstige
Keine Angabe
Englisch
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