Gold content of plating solution is assayed by simple method that required only ordinary electrochemical laboratory equipment and materials. Technique involves electrodeposition of gold from solution onto electrode, the weight gain of which is measured. Suitable fast assay methods are economically and practically necessary in electronics and decorative-plating industries. If gold content in plating bath is too low, poor plating may result, with consequent economic loss to user.
Electrochemical Assay of Gold-Plating Solutions
NASA Tech Briefs ; 6 , 3
1982-12-01
Sonstige
Keine Angabe
Englisch
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